MSC Software FEA package enables engineers with an integrated solution to perform linear statics, buckling, and dynamic analysis. FEA package unifies the capabilities of MSC Nastran and Patran. MSC Nastran enables engineers to use connectors for system-level analysis, integrate FE models with MSC Software’s multi-body simulation solution Adams, and leverage sophisticated optimization tools. It can also be leveraged to predict product behavior when subjected to shock with MSC Nastran’s Dynamic Design Analysis Method. Engineers can leverage this for studying steady state and transient thermal scenarios, and rotor dynamics.

The AFEA package unifies the power of Marc, the nonlinear solution to the Patran environment. Marc enables engineers to accurately model multiple loading scenarios under diverse environmental conditions as well as a wide range of materials such as metals, shape memory alloys, wood, plastics, rubbers, glass, concrete, and powder metals, etc. Its multiphysics capabilities can be leveraged for simulating processes such as welding, curing, and forming. Engineers and designers can use the intelligence of Marc’s algorithms to set up contact scenarios, efficiently analyze the product performance as well as predict design failures early in the development phase for undertaking corrective measures.

The TFEA package is quite invaluable for thermal engineers. It combines the power and flexibility offered by MSC Sinda’s thermal analysis solver with Patran and offers a fully integrated thermal analysis tool. Sinda helps in the efficient study of the impact of material properties, boundary conditions, and other design parameters on thermal performance. It can also be seamlessly integrated with other thermal analysis tools such as NEVADA, Thermica, TSS, and TRASYS. By passing temperatures to a structural model, Sinda supports thermal distortion and thermal stress analysis as well as in view factor radiation studies with the help of SindaRad. Sinda helps thermal engineers build models by leveraging a resistance-capacitance network approach.